Formation of Slit-Like Voids at Trench Corners of Damascene Cu Interconnects

• Sekiguchi Atsuko

  Department of Materials Science, Tohoku University

• Koike Junichi

  Department of Materials Science, Tohoku University

• Maruyama Kouichi

  Department of Materials Science, Tohoku University

Bibliographic Information

Other Title

• Formation of slit-llike voids at trench corners of damascene Cu interconnects

Abstract

Stress voiding was investigated in damascene Cu lines embedded in Ta/TaN/SiO₂/Si. Microstructure was observed before and after heat treatment at 723 K using a focused ion beam (FIB) technique. The distribution of thermal stress was calculated using a three-dimensional finite element method (FEM). FIB observation revealed that slit-like voids were formed at trench shoulders both before and after heat treatment. FEM calculation indicated that a large shear stress concentration occurred at the voided sites. The coincidence between the FIB observation and the FEM calculation suggests that the slit-like voids were formed by shear-mode delamination of Cu from the Ta/TaN barrier layer.

Journal

• MATERIALS TRANSACTIONS

  MATERIALS TRANSACTIONS 43 (7), 1633-1637, 2002

  The Japan Institute of Metals and Materials

Keywords

• copper
• interconnect
• void
• stress
• interface

Details

• CRID: 1390282679223562496
• NII Article ID: 10012325354
• NII Article ID: 130004451875
• NII Book ID: AA1151294X
• DOI: 10.2320/matertrans.43.1633
• COI: 1:CAS:528:DC%2BD38Xmt1equ70%3D
• ISSN: 13475320
• ISSN: 13459678
• HANDLE: 10097/51992
• NDL BIB ID: 6240758
• Web Site: https://tohoku.repo.nii.ac.jp/records/26601
• Web Site: https://ndlsearch.ndl.go.jp/books/R000000004-I6240758
• Web Site: https://www.jstage.jst.go.jp/article/matertrans/43/7/43_7_1633/_pdf
• Text Lang: en
• Data Source:
  • JaLC
  • IRDB
  • NDL
  • Crossref
  • CiNii Articles
• Abstract License Flag: Disallowed