Simulation Analysis and Experimental Verification of UV-LIGA Process for High-Aspect-Ratio Ni-Fe Micro-Mold Insert

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  • Yeh Yih-Min
    Department of Material Science and Engineering, National Chiao Tung University
  • Tu George-Chia
    Department of Material Science and Engineering, National Chiao Tung University
  • Fu Ming-Nan
    Department of Industrial Engineering and Management, Chin Min College

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Abstract

UV (ultra violet)-LIGA (a German acronym for lithographie, gavanoformung, abformung), a low-cost microcomponent manufacturing technology for micro-electromechanical systems (MEMS), combines the UV patterning of thick photoresist layers with the molding of the resulting patterns by electroforming. It enables mass production of microcomponents using microinjection molding or hot embossing technology. This paper addresses the characteristics of the flow field and the mass transfer effect during micro-electroforming processes. A micro-electroforming experiment is conducted and a simulation is performed to determine optimal conditions for fine surface forming by micro-electroforming. Results show that a smaller diameter of a hole corresponds to poorer plating bath transfer. Plating bath can be replenished by increasing the rotation speed of the electrodes. However, mass transfer is still limited in holes with a high aspect ratio. The theoretical results of simulation analysis were verified by conducting practical electroforming experiments.

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