銅電解精製における高分子添加剤の影響 Effects of Polymer Additives on Copper Electrorefining

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Effects of polymer additives such as gelatin and polyethylene glycol (PEG) on Cu electrodeposition behavior have been investigated by measuring the polarization curves for Cu deposition and the amount of additive adsorbed on Cu powder. Gelatin and PEG act as a polarizer for Cu deposition to shift the cathode potential in a less noble direction. The degree of polarization increased with an increase in the concentration and the molecular weight of additives, while the polarization effect of PEG was decreased when the molecular weight exceeded 10<sup>3</sup>. Since the amount of gelatin adsorbed on Cu powder increased with increasing the molecular weight, the polarization effect of gelatin appears to depend on its adsorptive activity on the cathode. The morphology of deposited Cu showed the compacted surface composed of fine grains with an increase in the polarization of cathode potential by the additives.

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  • 資源と素材 : 資源・素材学会誌 : journal of the Mining and Materials Processing Institute of Japan

    資源と素材 : 資源・素材学会誌 : journal of the Mining and Materials Processing Institute of Japan 119(10), 663-667, 2003-11-25

    一般社団法人 資源・素材学会

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各種コード

  • NII論文ID(NAID)
    10012540283
  • NII書誌ID(NCID)
    AN10062646
  • 本文言語コード
    JPN
  • 資料種別
    ART
  • ISSN
    09161740
  • NDL 記事登録ID
    6774967
  • NDL 雑誌分類
    ZP41(科学技術--金属工学・鉱山工学)
  • NDL 請求記号
    Z17-315
  • データ提供元
    CJP書誌  CJP引用  NDL  J-STAGE 
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