Tribology and Removal Rate Characteristics of Abrasive-Free Slurries for Copper CMP Applications

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This study employs real-time high-frequency frictional force analysis coupled with removal rate studies to quantify the extent of frictional forces encountered during copper polish using abrasive-free slurries and to establish the time-dependent tribological attributes of the process. The study also uses spectral analysis of the frictional force data to validate and explore the subtle characteristics of the formation and extinction of the copper complex layer known to play an integral role in abrasive-free copper chemical mechanical planarization (CMP). It was found that copper removal rates are at least partially driven by coefficient of friction, which is similar to the case of interlayer dielectric (ILD) CMP. Spectral analysis suggests that the periodicity of the copper complex layer formation and abrasion is approximately 10 ms.

収録刊行物

  • Japanese journal of applied physics. Pt. 1, Regular papers & short notes

    Japanese journal of applied physics. Pt. 1, Regular papers & short notes 42(11), 6809-6814, 2003-11-15

    公益社団法人 応用物理学会

参考文献:  10件中 1-10件 を表示

  • <no title>

    SAITOH T.

    Proc. Electrochemical Society Meeting in Pennington, NJ, 2002, Abstract No. 389, 2002

    被引用文献1件

  • <no title>

    PHILIPOSSIAN A.

    Micro 20, 85, 2002

    被引用文献2件

  • <no title>

    LU J.

    Mater. Res. Soc. Symp. Proc. 613, E1.2.1, 2000

    被引用文献2件

  • <no title>

    OLSEN S. F.

    Master's Thesis, University of Arizona, Tucson, AZ, 2002, 2002

    被引用文献1件

  • Friction. Wear, Lubrication

    LUDEMA K.

    A Textbook in Tribology 117, 1996

    被引用文献1件

  • <no title>

    BRIGHAM E.

    The Fast Fourier Transform and Its Applications, 1988

    被引用文献1件

  • <no title>

    PHILIPOSSIAN A.

    Proc. Electrochemical Society Meeting in Pennington, NJ, 2002, Abstract No. 385, 2002

    被引用文献1件

  • <no title>

    PRESTON F.

    J. Soc. Glass Technol. 11, 214, 1927

    被引用文献4件

  • <no title>

    HUGHES-HALLET D.

    Calculus 378, 1994

    被引用文献1件

  • <no title>

    KONDO

    J. Electrochem. Soc. 147, 3907, 2000

    DOI 被引用文献11件

被引用文献:  1件中 1-1件 を表示

各種コード

  • NII論文ID(NAID)
    10012563782
  • NII書誌ID(NCID)
    AA10457675
  • 本文言語コード
    EN
  • 資料種別
    ART
  • 雑誌種別
    大学紀要
  • ISSN
    0021-4922
  • NDL 記事登録ID
    6752245
  • NDL 雑誌分類
    ZM35(科学技術--物理学)
  • NDL 請求記号
    Z53-A375
  • データ提供元
    CJP書誌  CJP引用  NDL  J-STAGE  JSAP 
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