Influence of Substrate Biasing on (Ba,Sr)TiO3 Films Prepared by Electron Cyclotron Resonance Plasma Sputtering

  • Matsumoto Takeshi
    Joining and Welding Research Institute, Osaka University
  • Niino Atsushi
    Joining and Welding Research Institute, Osaka University
  • Ohtsu Yasunori
    Department of Electrical and Electronic Engineering, Faculty of Science and Engineering, Saga University
  • Misawa Tatsuya
    Department of Electrical and Electronic Engineering, Faculty of Science and Engineering, Saga University
  • Yonesu Akira
    Department of Electrical and Electronic Engineering, Faculty of Engineering, Ryukyu University
  • Fujita Hiroharu
    Department of Electrical and Electronic Engineering, Faculty of Science and Engineering, Saga University
  • Miyake Shoji
    Joining and Welding Research Institute, Osaka University

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  • Influence of Substrate Biasing on (Ba,Sr)TiO<sub>3</sub> Films Prepared by Electron Cyclotron Resonance Plasma Sputtering

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Abstract

(Ba,Sr)TiO3 (BST) films were deposited by electron cyclotron resonance (ECR) plasma sputtering with mirror confinement. DC bias voltage was applied to Pt/Ti/SiO2/Si substrates during deposition to vary the intensity of bombardment of energetic ions and to modify film properties. BST films deposited on the substrates at floating potential (approximately +20 V) were found to be amorphous, while films deposited on +40 V-biased substrates were crystalline in spite of a low substrate temperature below 648 K. In addition, atomic diffusion, which causes deterioration in the electrical properties of the films, was hardly observed in the crystallized films deposited with +40 V bias perhaps due to the low substrate temperature. Plasma diagnoses revealed that application of a positive bias to the substrate reduced the energy of ion bombardment and increased the density of excited neutral particles, which was assumed to result in the promotion of chemical reactions during deposition and the crystallization of BST films at a low temperature.

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