下地層ならびに超高真空中加熱プロセスによるCu薄膜の面内結晶粒径の増大と表面平坦化 Lateral Grain Size Enlargement and Surface Flattening of Cu Thin Films by using Adequate Underlayers and by Thermal Annealing in Ultra High Vacuum

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The effects of body centered cubic (BCC) solid solution underlayers on the metallurgical size and flatness of Cu thin films, fabricated on them, were investigated. As the underlayer materials, Cr<SUB>80</SUB>Al<SUB>20</SUB>, Cr<SUB>90</SUB>Ni<SUB>10</SUB>, Cr<SUB>80</SUB>Fe<SUB>20</SUB>, Fe<SUB>75</SUB>Cr<SUB>25</SUB> and Fe were examined. Lateral grain size of the Cu films fabricated on the Cr-Al, Cr-Ni, Cr-Fe, Fe-Cr under layer was enlarged, comparing to that on the Fe underlayer. The difference between the surface energy (γ<SUP>X</SUP><SUB>S</SUB>) and the interfacial energy (γ<SUP>X-Cu-</SUP><SUB>SL</SUB>) of these underlayer is close to the surface energy of Cu at the melting point (γ<SUP>Cu</SUP><SUB>S</SUB> (<I>T</I><SUB>m</SUB>)). However, the surface roughness of Cu films simultaneously increased with increasing the lateral grain size. In order to suppress the surface roughening of Cu films, post-thermal annealing procedure was applied under the ultra-high vacuum for the films fabricated on the Cr-Ni and Cr-Ni-Fe underlayers. We finally succeeded to enlarge the lateral grain diameter more than 100 nm for 50-nm-thick Cu films, maintaining a flat surface (<I>R</I><SUB>a</SUB> = 0.32 nm).

収録刊行物

  • 真空 = JOURNAL OF THE VACUUM SOCIETY OF JAPAN

    真空 = JOURNAL OF THE VACUUM SOCIETY OF JAPAN 47(3), 124-127, 2004-03-20

    The Vacuum Society of Japan

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各種コード

  • NII論文ID(NAID)
    10012866973
  • NII書誌ID(NCID)
    AN00119871
  • 本文言語コード
    JPN
  • 資料種別
    SHO
  • ISSN
    05598516
  • NDL 記事登録ID
    6929310
  • NDL 雑誌分類
    ZN15(科学技術--機械工学・工業--流体機械)
  • NDL 請求記号
    Z16-474
  • データ提供元
    CJP書誌  NDL  J-STAGE 
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