Nanometer-Scale Metal Plating Using a Scanning Shear-Force Microscope with an Electrolyte-Filled Micropipette Probe

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We describe a novel technique of local metal plating using a scanning probe microscope with a micropipette probe filled with an electrolyte solution. An electrode wire inside the electrolyte-filled micropipette and Si surfaces were employed as the anode and the cathode, respectively. Nanometer-scale Cu dots could be electrochemically deposited on the Si surfaces as the micropipette probe was nearly in contact with the surfaces with application of a dc voltage between the electrode wire and the surfaces. It was possible to control the size of the Cu dots by adjusting the deposition time and voltage. Dot arrays and line patterns were sequentially fabricated as the pipette probe scanned the surfaces while changing the probe-to-surface distance under shear-force control. This technique of local metal plating could allow the fabrication of nanostructures such as nanomachines and nanoelectronics.

収録刊行物

  • Japanese journal of applied physics. Pt. 1, Regular papers & short notes

    Japanese journal of applied physics. Pt. 1, Regular papers & short notes 43(7B), 4482-4485, 2004-07-15

    Published by the Japan Society of Applied Physics through the Institute of Pure and Applied Physics

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各種コード

  • NII論文ID(NAID)
    10013431046
  • NII書誌ID(NCID)
    AA10457675
  • 本文言語コード
    EN
  • 資料種別
    ART
  • 雑誌種別
    大学紀要
  • ISSN
    0021-4922
  • NDL 記事登録ID
    7028938
  • NDL 雑誌分類
    ZM35(科学技術--物理学)
  • NDL 請求記号
    Z53-A375
  • データ提供元
    CJP書誌  CJP引用  NDL  J-STAGE  JSAP 
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