A New Surface Modification Method to Prevent the Release-Stiction of Micromechanical Structures during HF Vapor-Phase Etching

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著者

    • Jung Sung Hae
    • Electronics and Telecommunications Research Institute (ETRI), 161 Gajeong-Dong, Yuseong-Gu, Daejeon 305-350, Korea
    • Kim Yoon Tae
    • Electronics and Telecommunications Research Institute (ETRI), 161 Gajeong-Dong, Yuseong-Gu, Daejeon 305-350, Korea

抄録

A novel release process without stiction problem is a major concern in surface micromachining technology to fabricate microelectromechanical systems (MEMS) devices. HF vapor-phase etching (VPE) has been focused as a promising dry process to remove sacrificial SiO2 layer, but still has limitation due to water condensation. We have first demonstrated the effectiveness of a new surface modification method using strongly hydrophilic materials (i.e., Ti, Al2O3) in preventing the release-stiction during HF VPE process. The role of hydrophilic surface layer is proposed to suppress the water bridging causing a attractive capillary force between micromechanical and stationary structures.

収録刊行物

  • Japanese journal of applied physics. Pt. 1, Regular papers & short notes

    Japanese journal of applied physics. Pt. 1, Regular papers & short notes 43(9A), 6008-6011, 2004-09-15

    公益社団法人 応用物理学会

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各種コード

  • NII論文ID(NAID)
    10013573295
  • NII書誌ID(NCID)
    AA10457675
  • 本文言語コード
    EN
  • 資料種別
    ART
  • 雑誌種別
    大学紀要
  • ISSN
    0021-4922
  • NDL 記事登録ID
    7079208
  • NDL 雑誌分類
    ZM35(科学技術--物理学)
  • NDL 請求記号
    Z53-A375
  • データ提供元
    CJP書誌  NDL  J-STAGE  JSAP 
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