Intention to Special Edition (<Special Articles>Instrumental Technology for Supporting High Density Pakages)

• NAKAMURA Yoshikazu

  Graduate School, Kokushikan University

Bibliographic Information

Other Title

• 特集に寄せて(<特集>高密度実装を支える装置技術)

Journal

• Journal of Japan Institute of Electronics Packaging

  Journal of Japan Institute of Electronics Packaging 6 (2), 117-, 2003-03-01

  Japan Institute of Electronics Packaging

Details

• CRID: 1571980075001948800
• NII Article ID: 10013958415
• NII Book ID: AA11231565
• ISSN: 13439677
• Text Lang: ja
• Data Source:
  • CiNii Articles