熱硬化性薄膜フィルム接着剤 Thin Thermosetting Adhesive Films

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The advantages and limitations of extremely thin thermosetting adhesive film (TTAF) are discussed. The properties of TTAF with a thickness range between 5 and 35 micrometers were investigated. The strength of adhesion was found to strongly depend on the film thickness below 10 micrometers. These behaviors can be explained by the Kaelble's equation and Goland-Reissner analysis. Effect of adhesive thickness on the solder heat resistance was also measured. A model based on fracture mechanical analyses for blister test was introduced to predict the adhesive debonding during solder reflow. The model predicted little thickness dependence of the solder heat resistance. On the other hand, higher solder heat resistance was observed for thinner adhesive samples. Since the ultimate adhesive thickness depends on the bonding process, the flow study for TTAF is important. Novel analytical method of the adhesive flow is developed.

収録刊行物

  • エレクトロニクス実装学会誌

    エレクトロニクス実装学会誌 6(3), 248-253, 2003-05-01

    社団法人エレクトロニクス実装学会

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各種コード

  • NII論文ID(NAID)
    10013958641
  • NII書誌ID(NCID)
    AA11231565
  • 本文言語コード
    JPN
  • 資料種別
    ART
  • ISSN
    13439677
  • NDL 記事登録ID
    6573329
  • NDL 雑誌分類
    ZN33(科学技術--電気工学・電気機械工業--電子工学・電気通信)
  • NDL 請求記号
    Z74-B258
  • データ提供元
    CJP書誌  NDL  NII-ELS 
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