はんだ接合強度に及ぼす無電解ニッケル-置換金めっきプロセスの影響 Effect of Electroless Nickel/Displacement Gold Plating Process on Strength of Solder Joint

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Electroless nickel plating has been applied for the formation of electronics circuits due to the downsizing of electronic components. However, solderability of electroless deposited nickel films is usually inferior to that of electrolytic deposited nickel films. In this paper, we focused on the relationship between the strength of solder joint and deposited nickel condition. Thickness of P-rich layer and morphology of the deposited nickel films affect the strength of solder joint. It was found that P-rich layers are formed at the subsurface of the deposited nickel and these layers are significantly changed after treatment of gold displacement. The strength of solder joints increases with decreasing P-rich layer. In this study, we found that the deposit condition of electroless nickel film also influences on the strength of solder joint.

収録刊行物

  • エレクトロニクス実装学会誌

    エレクトロニクス実装学会誌 6(4), 339-344, 2003-07-01

    社団法人エレクトロニクス実装学会

参考文献:  9件中 1-9件 を表示

被引用文献:  2件中 1-2件 を表示

各種コード

  • NII論文ID(NAID)
    10013958762
  • NII書誌ID(NCID)
    AA11231565
  • 本文言語コード
    JPN
  • 資料種別
    ART
  • ISSN
    13439677
  • NDL 記事登録ID
    6635109
  • NDL 雑誌分類
    ZN33(科学技術--電気工学・電気機械工業--電子工学・電気通信)
  • NDL 請求記号
    Z74-B258
  • データ提供元
    CJP書誌  CJP引用  NDL  NII-ELS 
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