Sn-Zn BGAの接続信頼性 Joint Reliability of Sn-Zn BGA

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著者

    • 大森 弘治 OMORI Kouji
    • 松下電器産業株式会社半導体社生産技術センター Production Center, Semiconductor Company, Matsushita Electric Co., Ltd.
    • 老田 成志 OIDA Seishi
    • 松下電器産業株式会社半導体社生産技術センター Production Center, Semiconductor Company, Matsushita Electric Co., Ltd.
    • 竹内 誠 TAKEUCHI Makoto
    • 日本ビクター株式会社生産技術本部生産技術研究所開発部 Production Division, Victor Company of Japan, Ltd. Yamato Plant
    • 金井 和久 KANAI Kazuhisa
    • 日本ビクター株式会社生産技術本部生産技術研究所開発部 Production Division, Victor Company of Japan, Ltd. Yamato Plant
    • 小薗 晋哉 KOZONO Shinya
    • 日本ビクター株式会社生産技術本部生産技術研究所開発部 Production Division, Victor Company of Japan, Ltd. Yamato Plant

抄録

In the protection of the earth environment, the substitution of the solder material that does not contain lead (Pb) is advanced. Sn-3Ag-0.5Cu is frequently adopted as a de facto standard composition the solder paste material for the mounting. Sn-3Ag-0.5Cu solder which are the same to mounting solder composition are mass-produced about the solder ball used to package BGA. However, Sn-Ag solder have a big problem in thermal damage for heatproof parts because of being about 40℃ higher than past eutectic solder. To solve this problem, we should consider the low reflow process. As for Sn-Zn solder, the expectation is also great as present equipment can be used, and practical use is begun. And we should consider with the low temperature process for low-cost and reliability in the semiconductor package assembly. We paid attention to the Sn-Zn solder material for solder ball material used to package BGA, and report on the influence in the solder joint reliability and the process of the packaging.

収録刊行物

  • エレクトロニクス実装学会誌

    エレクトロニクス実装学会誌 6(5), 428-432, 2003-08-01

    社団法人エレクトロニクス実装学会

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各種コード

  • NII論文ID(NAID)
    10013958892
  • NII書誌ID(NCID)
    AA11231565
  • 本文言語コード
    JPN
  • 資料種別
    ART
  • ISSN
    13439677
  • NDL 記事登録ID
    6662822
  • NDL 雑誌分類
    ZN33(科学技術--電気工学・電気機械工業--電子工学・電気通信)
  • NDL 請求記号
    Z74-B258
  • データ提供元
    CJP書誌  NDL  NII-ELS 
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