Sn-Zn-Alはんだのはんだ付け性と接合信頼性に関する研究 A Study on the Solderbility and Joint Reliability of Lead-Free Sn-Zn-Al Solder

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著者

    • 北嶋 雅之 KITAJIMA Masayuki
    • 富士通株式会社生産技術本部先行生産技術開発部 Corporate Product Engineering Group, Advanced Production Technology Development Division, Fujitsu Limited
    • 庄野 忠昭 SHONO Tadaaki
    • 富士通株式会社生産技術本部先行生産技術開発部 Corporate Product Engineering Group, Advanced Production Technology Development Division, Fujitsu Limited
    • 荻野 武久 [他] OGINO Takehisa
    • 富士通周辺機株式会社第一事業部第二製造部 Division-1, Manufacturing Department-2, Manufacturing Section, Fujitsu Peripherals Limited
    • 小林 鉄也 KOBAYASHI Tetsuya
    • 富士通周辺機株式会社第一事業部第二製造部 Division-1, Manufacturing Department-2, Manufacturing Section, Fujitsu Peripherals Limited
    • 山崎 一寿 YAMAZAKI Kazutoshi
    • 株式会社富士通研究所材料・環境技術研究所ナノ電子材料研究部 Nano-Electronic Materials Research and Engineering Laboratory, Fujitsu Laboratories Limited
    • 野口 道子 NOGUCHI Michiko
    • 株式会社富士通研究所材料・環境技術研究所ナノ電子材料研究部 Nano-Electronic Materials Research and Engineering Laboratory, Fujitsu Laboratories Limited

抄録

We have implemented a company-wide effort to progressively reduce the use of lead and eventually eliminate this environmental pollutant from its products. As part of this effort, a new lead-free solder, which consists of tin, zinc, and aluminum,has been developed and also offers superior productivity and joint reliability. The new lead-free solder has a melting point equivalent to that of a tin-lead eutectic solder, and enables devices to be packaged at a lower temperature than the increasingly popular tin-silver-copper solder. Thus, the new lead-free solder accelerates the elimination of lead from products. We have already used PC boards containing the new lead-free solder in some products, and plans to extend its use to other products. This paper describes the characteristics of the new lead-free solder and the results of a study on its practical use.

収録刊行物

  • エレクトロニクス実装学会誌

    エレクトロニクス実装学会誌 6(5), 433-438, 2003-08-01

    社団法人エレクトロニクス実装学会

参考文献:  5件中 1-5件 を表示

被引用文献:  1件中 1-1件 を表示

各種コード

  • NII論文ID(NAID)
    10013958895
  • NII書誌ID(NCID)
    AA11231565
  • 本文言語コード
    JPN
  • 資料種別
    ART
  • ISSN
    13439677
  • NDL 記事登録ID
    6662835
  • NDL 雑誌分類
    ZN33(科学技術--電気工学・電気機械工業--電子工学・電気通信)
  • NDL 請求記号
    Z74-B258
  • データ提供元
    CJP書誌  CJP引用  NDL  NII-ELS 
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