Critical Issues in Computational Modeling and Fatigue Life Analysis for PBGA Solder Joints

• ZHANG X.

収録刊行物

• The International Journal of Microcircuits and Electronic Packaging

  The International Journal of Microcircuits and Electronic Packaging 21 (3), 253-261, 1998

詳細情報

• CRID: 1573387449702630400
• NII論文ID: 10014858303
• データソース種別:
  • CiNii Articles