X線を用いた高速・高精度はんだバンプ検査手法の開発  [in Japanese] High Speed and High Precision Solder Bump Inspection Method Using X-ray Fluoroscopy  [in Japanese]

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Author(s)

Abstract

This paper proposes a technique to inspect the bump height, area and volume of solder bump using X-ray fluoroscopy. Since X-ray fluoroscopy can acquire the 2-dimensional signal proportional to the thickness of a solder, it is expectable to measure a solder bump with high precision and at high speed. We introduced some image processing method to correct unevenness of image. Furthermore we introduced X-ray monitor in order to decrease the effect of X-ray fluctuation. As a result, fluctuation decrease more than 50% than without X-ray monitor. By compare to the optical measurement method, this method shows advantageous result at the viewpoint of bump coverage area and inspection speed.

Journal

  • IEEJ Transactions on Industry Applications

    IEEJ Transactions on Industry Applications 125(6), 652-658, 2005-06-01

    The Institute of Electrical Engineers of Japan

References:  13

Cited by:  4

Codes

  • NII Article ID (NAID)
    10015671945
  • NII NACSIS-CAT ID (NCID)
    AN10012320
  • Text Lang
    JPN
  • Article Type
    Journal Article
  • ISSN
    09136339
  • NDL Article ID
    7386104
  • NDL Source Classification
    ZN31(科学技術--電気工学・電気機械工業)
  • NDL Call No.
    Z16-1608
  • Data Source
    CJP  CJPref  NDL  J-STAGE 
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