Role of Nitrogen Incorporation into Hf-Based High-k Gate Dielectrics for Termination of Local Current Leakage Paths
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- Watanabe Heiji
- Department of Precision Science and Technology, Graduate School of Engineering, Osaka University
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- Kamiyama Satoshi
- Semiconductor Leading Edge Technologies, Inc.
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- Umezawa Naoto
- National Institute for Materials Science
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- Shiraishi Kenji
- Institute of Physics, University of Tsukuba
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- Yoshida Shiniti
- Department of Precision Science and Technology, Graduate School of Engineering, Osaka University
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- Watanabe Yasumasa
- Department of Precision Science and Technology, Graduate School of Engineering, Osaka University
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- Arikado Tsunetoshi
- Semiconductor Leading Edge Technologies, Inc.
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- Chikyow Toyohiro
- National Institute for Materials Science
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- Yamada Keisaku
- Nanotechnology Research Laboratories, Waseda University
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- Yasutake Kiyoshi
- Department of Precision Science and Technology, Graduate School of Engineering, Osaka University
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Abstract
We studied effects of nitrogen incorporation into Hf-based high-k gate dielectrics on local insulating properties by conductive atomic force microscopy. Nitrogen-incorporated HfSiO/HfO2/SiO2 gate stacks exhibited excellent dielectric reliability, whereas we observed the creation of local leakage sites for untreated gate stacks, i.e., without nitridation. Both types of high-k dielectric layers were crystallized, and there was no relationship between the current leakage sites and surface morphology. These findings indicate that grain boundaries of the high-k films do not act as the leakage sites. Instead, we propose nitrogen incorporation as an important method for terminating the current leakage paths and discuss detailed mechanisms based on first-principles calculations.
Journal
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- Japanese Journal of Applied Physics
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Japanese Journal of Applied Physics 44 (42-45), L1333-L1336, 2005
The Japan Society of Applied Physics
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Keywords
Details 詳細情報について
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- CRID
- 1390001206269501440
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- NII Article ID
- 10016856711
- 210000059364
- 130004766249
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- NII Book ID
- AA11906093
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- ISSN
- 13474065
- 00214922
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- NDL BIB ID
- 7694224
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- Text Lang
- en
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- Data Source
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- JaLC
- NDL
- Crossref
- CiNii Articles
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- Abstract License Flag
- Disallowed