はんだバンプに発生した微小ボイドの自動検出  [in Japanese] Automated Detection of Micro Void in Solder Bump  [in Japanese]

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Author(s)

Abstract

In the flip chip junction, void in the solder bump has serious influences on reliability and electric characteristic. In this paper, we propose an automated detection technique of micro voids in solder bump. The void makes hollow on the bump shape in X-ray image. We developed subtraction-based method by means of combination of morphology filter and image subtraction to detect the voids. Furthermore, we introduced noise elimination method using some void feature values and discriminant analysis. We evaluated this technique using simulation model and real bump. As a result, a correct rate reached 99.2%, which demonstrates this technique has very high detection ability.

Journal

  • IEEJ Transactions on Industry Applications

    IEEJ Transactions on Industry Applications 126(11), 1514-1521, 2006-11-01

    The Institute of Electrical Engineers of Japan

References:  9

Cited by:  2

Codes

  • NII Article ID (NAID)
    10018318653
  • NII NACSIS-CAT ID (NCID)
    AN10012320
  • Text Lang
    JPN
  • Article Type
    Journal Article
  • ISSN
    09136339
  • NDL Article ID
    8561395
  • NDL Source Classification
    ZN31(科学技術--電気工学・電気機械工業)
  • NDL Call No.
    Z16-1608
  • Data Source
    CJP  CJPref  NDL  J-STAGE 
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