Effects of grain-boundary sliding and plastic deformation of grains on the formation of grain-boundary cracks in a double cylindrical bicrystal of a Cu-SiO2 alloy

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  • Seki Masakazu
    Department of Innovative and Engineered Materials, Tokyo Institute of Technology
  • Fujimoto Mitsuru
    Department of Materials Science and Engineering, Tokyo Institute of Technology
  • Fujii Toshiyuki
    Department of Innovative and Engineered Materials, Tokyo Institute of Technology
  • Kato Masaharu
    Department of Materials Science and Engineering, Tokyo Institute of Technology
  • Onaka Susumu
    Department of Materials Science and Engineering, Tokyo Institute of Technology

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タイトル別名
  • Effects of Grain-Boundary Sliding and Plastic Deformation of Grains on the Formation of Grain-Boundary Cracks in a Double Cylindrical Bicrystal of a Cu-SiO<SUB>2</SUB> Alloy

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A double cylindrical bicrystal is a bicrystal consisting of a cylindrical inside grain with a second grain wrapped around its curved side surface. Using a double cylindrical bicrystal of a Cu-SiO2 alloy, tensile tests were performed at 800 K under 2×10−4 s−1. Three specimens cut from the same bicrystal were deformed to three different strains. Preferential formation of grain-boundary cracks around the cylindrical inside grain was observed after the tensile tests. In addition to the occurrence of grain-boundary sliding, the misfit of slip deformation at the grain boundary affects the formation of the grain-boundary cracks.

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