Hydrogenation Induced Bending Motion of Composite Device of La-Ni Alloy Film Deposited on Copper Foil

• Nishi Yoshitake

  Department of Metallurgical Engineering, Graduate School of Engineering, Tokai University

• Uchida Haru-Hisa

  Department of Human Developments, School of Humanity and Culture, Tokai University

• Numazaki Kenichi

  Department of Metallurgical Engineering, Graduate School of Engineering, Tokai University

抄録

In order to obtain a large movement with high power and responsiveness, a hydrogenation operated bimetal device made of La-Ni alloy film deposited on a thin copper (Cu) substrate foil, has been successfully developed. The sample of La-Ni film deposited on the Cu thin foil exhibits about 50% larger bending displacement than that on a thick sheet of polyimide substrate within 50 s. The influence of load on bending motion has also been investigated. The moving yield of the La-Ni film deposited on the Cu thin foil is larger than that on a polyimide thick sheet.

収録刊行物

• MATERIALS TRANSACTIONS

  MATERIALS TRANSACTIONS 48 (11), 2964-2968, 2007

  公益社団法人 日本金属学会

キーワード

• high responsiveness
• mover device
• lanthanum-nickel film
• copper thin film
• palladium catalyst

詳細情報

• CRID: 1390001204250095744
• NII論文ID: 10019789643
• NII論文ID: 130004453421
• NII書誌ID: AA1151294X
• DOI: 10.2320/matertrans.mra2007087
• ISSN: 13475320
• ISSN: 13459678
• NDL書誌ID: 8979528
• Web Site: https://ndlsearch.ndl.go.jp/books/R000000004-I8979528
• Web Site: https://www.jstage.jst.go.jp/article/matertrans/48/11/48_MRA2007087/_pdf
• 本文言語コード: en
• データソース種別:
  • JaLC
  • NDL
  • Crossref
  • CiNii Articles
• 抄録ライセンスフラグ: 使用不可