Experimental and Theoretical Investigation of Viscoplastic Deformation of Solder Alloys for Electronic Packaging

• KOBAYASHI T.

収録刊行物

• Key Eng. Mater.

  Key Eng. Mater. 345 97-100, 2007

詳細情報

• CRID: 1570291225668524544
• NII論文ID: 10021065799
• データソース種別:
  • CiNii Articles