Impact Properties of Lead-Free Sn-Ag-Cu-Ni-Ge Solder Joint with Cu Electrode
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- Shohji Ikuo
- Department of Mechanical System Engineering, Graduate School of Engineering, Gunma University
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- Watanabe Hirohiko
- Fuji Electric Advanced Technology Co., Ltd.
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- Okashita Takeshi
- Department of Mechanical System Engineering, Faculty of Engineering, Gunma University
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- Osawa Tsutomu
- Department of Mechanical System Engineering, Graduate School of Engineering, Gunma University
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The impact properties of solder ball joints with Sn-Ag-Cu-Ni-Ge lead-free solders and Cu electrodes were investigated in the aged conditions at 393 K. The impact properties evaluated was compared with Sn-Ag and Sn-Ag-Cu solder joints. The impact properties of Sn-Ag-Cu-Ni-Ge joints were superior to those of Sn-Ag and Sn-Ag-Cu joints. In the cases of Sn-Ag and Sn-Ag-Cu joints, fracture mainly occurred in the intermetallic compounds (IMC) layer formed in the joint interface regardless of aging treatment. On the contrary, main fracture mode was solder fracture in as-reflow Sn-Ag-Cu-Ni-Ge joints. Although the main fracture mode gradually changed from solder fracture to IMC fracture upon aging, Sn-Ag-Cu-Ni-Ge joints had excellent impact reliability compared with Sn-Ag and Sn-Ag-Cu joints even after aging at 393 K for 1000 h.
収録刊行物
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- MATERIALS TRANSACTIONS
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MATERIALS TRANSACTIONS 49 (7), 1513-1517, 2008
公益社団法人 日本金属学会
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詳細情報 詳細情報について
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- CRID
- 1390282679225619584
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- NII論文ID
- 10021148074
- 130004454017
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- NII書誌ID
- AA1151294X
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- ISSN
- 13475320
- 13459678
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- NDL書誌ID
- 9555538
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- 本文言語コード
- en
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- データソース種別
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- JaLC
- NDL
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