Characteristics of Zn-Al-Cu Alloys for High Temperature Solder Application

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  • Kim Seong-Jun
    Department of Adaptive Machine Systems, Graduate School of Engineering, Osaka University
  • Kim Keun-Soo
    Institute of Scientific and Industrial Research, Osaka University
  • Kim Sun-Sik
    Institute of Scientific and Industrial Research, Osaka University
  • Kang Chung-Yun
    Department of Materials Engineering, Pusan National University
  • Suganuma Katsuaki
    Institute of Scientific and Industrial Research, Osaka University

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Melting range, microstructure, mechanical properties and spreadabililty of Zn-(4∼6 mass%)Al-(1∼6 mass%)Cu alloys were investigated. Liquidus temperature was targeted between 655 and 675 K, and solidus temperature was targeted to 645 K. The liquidus temperature of the Zn-Al-Cu solders increased with Cu contents, but it decreased with Al contents. Microstructures of the Zn-Al-Cu solders consisted of primary ε-phase (CuZn4), η-phase (Zn matrix), α-η eutectic phase (Zn-Al eutectic) and ε-η eutectic phase (Zn-Cu eutectic), irrespective of the Al and Cu contents. Increasing the Al and Cu contents, hardness and tensile strength increased, but elongation decreased. The Al content played an important role in improving the spread ratio, the Cu content had no significant influence on the spread ratio.

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