Interfacial Bonding Mechanism Using Silver Metallo-Organic Nanoparticles to Bulk Metals and Observation of Sintering Behavior
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- Akada Yusuke
- Department of Material and Manufacturing Science, Osaka University
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- Tatsumi Hiroaki
- Department of Material and Manufacturing Science, Osaka University
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- Yamaguchi Takuto
- Department of Material and Manufacturing Science, Osaka University
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- Hirose Akio
- Department of Material and Manufacturing Science, Osaka University
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- Morita Toshiaki
- Materials Research Laboratory, Hitachi. Ltd.
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- Ide Eiichi
- Materials Research Laboratory, Hitachi. Ltd.
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Abstract
We have proposed a novel bonding process using silver nanoparticles, which can be alternative to lead-rich high melting point solders. The bonding mechanism of silver metallo-organic nanoparticles to bulk materials (gold and copper) is discussed based on the observations of the bonded interface using Transmission Electron Microscope (TEM). At the interface of sintered silver and bulk gold, the crystal orientation of silver corresponded to that of gold. It is thought that the epitaxial layer of silver formed through silver nanoparticles being oriented in the direction of the gold crystal. At the interface of sintered silver and bulk copper, no epitaxial layer of silver on the copper crystal formed. Though the appearance of the crystal structure of silver/copper interface is different from that of the silver/gold interface, copper as well as gold are coherent with silver, and have been successfully bonded using the silver nanoparticles.
Journal
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- MATERIALS TRANSACTIONS
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MATERIALS TRANSACTIONS 49 (7), 1537-1545, 2008
The Japan Institute of Metals and Materials
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Details 詳細情報について
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- CRID
- 1390282679225869824
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- NII Article ID
- 10021148147
- 130004454034
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- NII Book ID
- AA1151294X
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- COI
- 1:CAS:528:DC%2BD1cXhtV2isr%2FM
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- ISSN
- 13475320
- 13459678
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- NDL BIB ID
- 9555562
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- Text Lang
- en
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- Data Source
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- JaLC
- NDL
- Crossref
- CiNii Articles
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- Abstract License Flag
- Disallowed