Improvement of EpoxyResin/Copper Foil Adhesion by Introduction of Sulfur-Containing Polymers

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  • 含硫黄ポリマー改質エポキシ樹脂硬化物の銅箔に対する接着性
  • ガン イオウ ポリマー カイシツ エポキシ ジュシ コウカブツ ノ ドウハク ニ タイスル セッチャクセイ

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Abstract

Epoxy resin is widely used in electronics and electric industries because of its superior properties. In recent years, excellent adhesive properties for metals (e.g.; copper, gold, aluminum, silver etc.) to which it is hard to adhere, have been desired for epoxy resin in the electric and electronics industrial fields. However, epoxy resin has only poor adhesive strength to the metals. In order to increase the adhesive strength between epoxy resin and copper foil, introduction of polymer modifiers containing sulfur, having strong interaction with metals, was investigated. TDP polyester and MPS polythioesters containing sulfur moieties were employed as the sulfur-containing modifiers for epoxy resin. Epoxy resin containing a modifier (3-10 phr) and a curing agent was cured between copper foil and aluminum plate at 120oC for 2 h and 170 oC for 2 h. The effect of the added modifiers was evaluated by the 90o peel testing method. All modifiers increased their peel strengths on the adhesion between epoxy resin and copper foil with bumpy surface. For the adhesion between the epoxy resin and copper foil with smooth surface, only two MPS polythioesters, MPS_5 and 7, have a beneficial effect on enhancement of their peel strengths.

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