銅の電気めっきにおける磁場効果 : スルーホールめっきへの応用 Effect of Magnetic Field on Copper Electroplating-Application to Through-Hole Plating

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In a magnetic field, an electrochemical reaction generates a macroscopic solution flow called MHD flow by the Lorentz force, which enhances mass transfer in the diffusion layer (MHD effect). In electroplating, the MHD effect comes from two-dimensional (2D) nucleation in an electrical double layer accompanied by the unstable growth of non-equilibrium fluctuations (called asymmetrical fluctuations). Electroplating under a magnetic field provides the other magnetic field effect called the micro-MHD effect, which emerges with micro-MHD flow and symmetrical non-equilibrium fluctuations in a diffusion layer, and suppresses three-dimensional (3D) nucleation. That is to say, the MHD effect acts as a positive catalyst, whereas the micro-MHD effect is employed as a negative catalyst, or inhibitor. Furthermore, owing to the strong penetration of the magnetic field into the materials, micro-MHD flows are effectively induced even in the inside of a complicated minute structure. Therefore, by controlling the magnetic field, we can expect high quality plating in the through-hole plating. In this paper, along with its application to through-hole plating, copper magneto-electroplating is examined from various aspects.

収録刊行物

  • 表面技術 = The Journal of the Surface Finishing Society of Japan

    表面技術 = The Journal of the Surface Finishing Society of Japan 59(6), 408-414, 2008-06-01

    一般社団法人 表面技術協会

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各種コード

  • NII論文ID(NAID)
    10021170217
  • NII書誌ID(NCID)
    AN1005202X
  • 本文言語コード
    JPN
  • 資料種別
    ART
  • ISSN
    09151869
  • NDL 記事登録ID
    9531269
  • NDL 雑誌分類
    ZP41(科学技術--金属工学・鉱山工学)
  • NDL 請求記号
    Z17-291
  • データ提供元
    CJP書誌  NDL  J-STAGE 
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