Effect of Magnetic Field on Copper Electroplating-Application to Through-Hole Plating
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- MORIMOTO Ryoichi
- Saitama Industrial Technology Center
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- YAZAWA Sadaharu
- Saitama Industrial Technology Center
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- AOGAKI Ryoichi
- Department of Electronic System Engineering, Polytechnic University
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- SUGIYAMA Atsushi
- Waseda Institute for Advanced Study, Waseda University
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- SAITOU Makoto
- Yoshino Denka Kogyo, Inc.
Bibliographic Information
- Other Title
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- 銅の電気めっきにおける磁場効果-スルーホールめっきへの応用-
- ドウ ノ デンキ メッキ ニ オケル ジバ コウカ スルーホール メッキ エノ オウヨウ
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Abstract
In a magnetic field, an electrochemical reaction generates a macroscopic solution flow called MHD flow by the Lorentz force, which enhances mass transfer in the diffusion layer (MHD effect). In electroplating, the MHD effect comes from two-dimensional (2D) nucleation in an electrical double layer accompanied by the unstable growth of non-equilibrium fluctuations (called asymmetrical fluctuations). Electroplating under a magnetic field provides the other magnetic field effect called the micro-MHD effect, which emerges with micro-MHD flow and symmetrical non-equilibrium fluctuations in a diffusion layer, and suppresses three-dimensional (3D) nucleation. That is to say, the MHD effect acts as a positive catalyst, whereas the micro-MHD effect is employed as a negative catalyst, or inhibitor. Furthermore, owing to the strong penetration of the magnetic field into the materials, micro-MHD flows are effectively induced even in the inside of a complicated minute structure. Therefore, by controlling the magnetic field, we can expect high quality plating in the through-hole plating. In this paper, along with its application to through-hole plating, copper magneto-electroplating is examined from various aspects.
Journal
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- Journal of The Surface Finishing Society of Japan
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Journal of The Surface Finishing Society of Japan 59 (6), 408-408, 2008
The Surface Finishing Society of Japan
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Details 詳細情報について
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- CRID
- 1390001204116620160
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- NII Article ID
- 10021170217
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- NII Book ID
- AN1005202X
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- COI
- 1:CAS:528:DC%2BD1cXntVyitr8%3D
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- ISSN
- 18843409
- 09151869
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- NDL BIB ID
- 9531269
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- Text Lang
- ja
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- Data Source
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- JaLC
- NDL
- Crossref
- CiNii Articles
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- Abstract License Flag
- Disallowed