Bonding Process Using Metallic Nanoparticles

• HIROSE Akio

  Graduate School of Engineering, Osaka University

Bibliographic Information

Other Title

• 最近の話題を追って　　金属ナノ粒子を用いた接合技術
• 金属ナノ粒子を用いた接合技術
• キンゾク ナノ リュウシ オ モチイタ セツゴウ ギジュツ

Journal

• Journal of The Surface Finishing Society of Japan

  Journal of The Surface Finishing Society of Japan 59 (7), 443-447, 2008

  The Surface Finishing Society of Japan

Keywords

• Ag Nanoparticles
• Sintering
• Bonding
• Electronics Assembly
• Pb Free

Details

• CRID: 1390282679093135360
• NII Article ID: 10021170323
• NII Book ID: AN1005202X
• DOI: 10.4139/sfj.59.443
• COI: 1:CAS:528:DC%2BD1cXosFKgur0%3D
• ISSN: 18843409
• ISSN: 09151869
• NDL BIB ID: 9571184
• Web Site: https://ndlsearch.ndl.go.jp/books/R000000004-I9571184
• Text Lang: ja
• Data Source:
  • JaLC
  • NDL
  • Crossref
  • CiNii Articles