In-Situ Analysis of Corrosion Behavior of Copper Wiring System in LSI by Atomic Force Microscopy
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- HONBO Kyoko
- Materials Research Laboratory, Hitachi, Ltd.
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- MABUCHI Katsumi
- Materials Research Laboratory, Hitachi, Ltd.
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- YAMADA Shinji
- Materials Research Laboratory, Hitachi, Ltd.
Bibliographic Information
- Other Title
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- 原子間力顕微鏡法を用いたLSI用Cu配線の腐食挙動解析
- ゲンシカンリョク ケンビキョウホウ オ モチイタ LSIヨウ Cu ハイセン ノ フショク キョドウ カイセキ
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Abstract
After the chemical mechanical planarization (CMP) processing of Cu wirings, defects are often observed and some of them induce problems in manufacturing large scale integrated circuit (LSI) devices. This investigation demonstrates that atomic force microscopy (AFM) is capable of performing in-situ nanoscopic visualization of initiation and growth processes of localized corrosion on the Cu wirings on LSI wafers in etching solutions of similar composition to the CMP process conditions. The AFM images indicate the presence of defects and dishings as a result of the CMP processing of the Cu wiring. The AFM analysis showed that defects and dishings became the starting points of pitting corrosion. The growth of corrosion is discussed in terms of cross-sectional and scaling analysis of AFM images. Moreover, the nanoscopic initiation and growth mechanisms of pitting corrosion and intergranular corrosion of Cu wiring are discussed based upon in-situ nanoscopic visualization by using AFM.
Journal
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- Journal of The Surface Finishing Society of Japan
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Journal of The Surface Finishing Society of Japan 59 (7), 470-476, 2008
The Surface Finishing Society of Japan
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Details 詳細情報について
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- CRID
- 1390282679093223936
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- NII Article ID
- 10021170402
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- NII Book ID
- AN1005202X
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- COI
- 1:CAS:528:DC%2BD1cXosFKgurk%3D
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- ISSN
- 18843409
- 09151869
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- NDL BIB ID
- 9571337
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- Text Lang
- ja
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- Data Source
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- JaLC
- NDL
- Crossref
- CiNii Articles
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- Abstract License Flag
- Disallowed