Behavior of plated microbumps during ultrasonic flip-chip bonding determined from dynamic strain measurement
Journal
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- Jpn. J. Appl. Phys. 1, Regul. Pap.
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Jpn. J. Appl. Phys. 1, Regul. Pap. 42 (4), 511-517, 2003
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Details 詳細情報について
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- CRID
- 1570291225658105600
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- NII Article ID
- 10021326345
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- Data Source
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- CiNii Articles