Bonding Technique Using Micro-Scaled Silver-Oxide Particles for <I>In-Situ</I> Formation of Silver Nanoparticles

• Morita Toshiaki

  Materials Research Laboratory, Hitachi Ltd.

• Yasuda Yusuke

  Materials Research Laboratory, Hitachi Ltd.

• Ide Eiichi

  Materials Research Laboratory, Hitachi Ltd.

• Akada Yusuke

  Division of Materials and Manufacturing Science, Osaka University

• Hirose Akio

  Division of Materials and Manufacturing Science, Osaka University

Bibliographic Information

Other Title

• Bonding technique using micro-scaled silver-oxide particles for In-situ formation of silver nanoparticles

Abstract

We investigated a new bonding technique utilizing micro-scaled silver-oxide (Ag₂O) particles. The results of our investigations revealed that bonding between electrodes using for semiconductor modules can be accomplished by adding myristyl alcohol to silver-oxide particles, followed by heating the mixture in air at 300°C under a pressure of 2.5 MPa. Since this bonding technique produces silver particles with a size of a few nanometers when the silver oxide is reduced by the presence of the alcohol, low-temperature sintering and bonding can be achieved.

Journal

• MATERIALS TRANSACTIONS

  MATERIALS TRANSACTIONS 49 (12), 2875-2880, 2008

  The Japan Institute of Metals and Materials

Keywords

• silver oxide
• reduction
• nanoparticle
• bonding technique
• epitaxial growth

Details

• CRID: 1390001204250969728
• NII Article ID: 10024404218
• NII Article ID: 130004453901
• NII Book ID: AA1151294X
• DOI: 10.2320/matertrans.mra2008269
• COI: 1:CAS:528:DC%2BD1MXhvVyns70%3D
• ISSN: 13475320
• ISSN: 13459678
• NDL BIB ID: 9728898
• Web Site: https://ndlsearch.ndl.go.jp/books/R000000004-I9728898
• Web Site: https://www.jstage.jst.go.jp/article/matertrans/49/12/49_MRA2008269/_pdf
• Text Lang: en
• Data Source:
  • JaLC
  • NDL
  • Crossref
  • CiNii Articles
• Abstract License Flag: Disallowed