Temperature and Strain Rate Dependence of Flow Stress in Severely Deformed Copper by Accumulative Roll Bonding

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  • Kunimine Takahiro
    Department of Materials Science and Engineering, Tokyo Institute of Technology
  • Takata Naoki
    Department of Metallurgy and Ceramics Science, Tokyo Institute of Technology
  • Tsuji Nobuhiro
    Department of Adaptive Machine Systems, Osaka University
  • Fujii Toshiyuki
    Department of Innovative and Engineered Materials, Tokyo Institute of Technology
  • Kato Masaharu
    Department of Materials Science and Engineering, Tokyo Institute of Technology
  • Onaka Susumu
    Department of Materials Science and Engineering, Tokyo Institute of Technology

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Tensile tests and strain rate jump tests have been carried out at low temperatures (77 K ∼ room temperature (RT)) using pure Cu specimens that were severely deformed by accumulative roll bonding (ARB). The dependence of the flow stress on the temperature and the strain rate has been investigated and the strain rate sensitivity m and its variation caused by the change in the ARB cycle N are discussed. At RT, the strain rate sensitivity for N≤4 stays at about 0.005. However, for N≥5, m increases with increasing N to become ∼0.018 when N=8. The deformation mechanisms of the ARB processed Cu are discussed with the activation volume V*. The temperature dependence of V* and its variation with increasing N are also discussed.

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