Direct Bonding to Aluminum with Silver-Oxide Microparticles

• Morita Toshiaki

  Materials Research Laboratory, Hitachi Ltd.

• Yasuda Yusuke

  Materials Research Laboratory, Hitachi Ltd.

• Ide Eiichi

  Materials Research Laboratory, Hitachi Ltd.

• Hirose Akio

  Division of Materials and Manufacturing Science, Osaka University

Abstract

This study demonstrated that direct bonding between electrode and aluminum by using silver oxide particles which added acetic acid silver, followed by heating in air at 350°C under a pressure of 2.5 MPa. Direct bonding with aluminum by using solder materials containing tin, lead, or the like has been impossible in the past. We think this technique creates strong bonding between silver and the natural oxide film formed on an aluminum surface by the combustion heat generated during oxidation of acetic acid (which is generated by decomposition of the silver acetate as it is heated).

Journal

• MATERIALS TRANSACTIONS

  MATERIALS TRANSACTIONS 50 (1), 226-228, 2009

  The Japan Institute of Metals and Materials

Keywords

• silver oxide
• reduction
• bonding technique
• aluminum

Details

• CRID: 1390282679225547520
• NII Article ID: 10024811426
• NII Article ID: 130004454081
• NII Book ID: AA1151294X
• DOI: 10.2320/matertrans.mrp2008277
• COI: 1:CAS:528:DC%2BD1MXis1ags74%3D
• ISSN: 13475320
• ISSN: 13459678
• NDL BIB ID: 9751117
• Web Site: https://ndlsearch.ndl.go.jp/books/R000000004-I9751117
• Web Site: https://www.jstage.jst.go.jp/article/matertrans/50/1/50_MRP2008277/_pdf
• Text Lang: en
• Data Source:
  • JaLC
  • NDL
  • Crossref
  • CiNii Articles
• Abstract License Flag: Disallowed