Evaluation of single liquid primers with organic sulfur compound for bonding between indirect composite material and silver-palladium-copper-gold alloy

  • SHIMOE Saiji
    Division of Oral Health Sciences, Hiroshima University Graduate School of Biomedical Sciences
  • TANOUE Naomi
    Division of General Dentistry, Nagasaki University Hospital
  • SATODA Takahiro
    Division of Oral Health Sciences, Hiroshima University Graduate School of Biomedical Sciences
  • MURAYAMA Takeshi
    Division of Oral Health Sciences, Hiroshima University Graduate School of Biomedical Sciences
  • NIKAWA Hiroki
    Division of Oral Health Sciences, Hiroshima University Graduate School of Biomedical Sciences
  • MATSUMURA Hideo
    Department of Fixed Prosthodontics, Nihon University School of Dentistry Division of Advanced Dental Treatment, Dental Research Center, Nihon University School of Dentistry

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Abstract

The purpose of this study was to evaluate the effect of primers on bonding between a silver-palladium-copper-gold alloy and an indirect composite material. Cast disks were air-abraded with alumina, conditioned with one of five primers (Alloy Primer, Luna-Wing Primer, Metal Primer II, Metaltite, M.L. Primer), and bonded with a light-activated indirect composite. Shear bond strengths were determined after 20,000 times of thermocycling. The results showed that four of the primers, except the Luna-Wing Primer, were effective in enhancing the bond strength as compared with the unprimed control group. Of these four primers, Alloy Primer, Metal Primer II, and M.L. Primer exhibited significantly greater bond strengths. It can be concluded that the effectiveness of primers varies considerably according to the organic sulfur compounds added to the solvent, and that care must be taken in selecting priming agents for bonding the composite material and the silver-palladium-copper-gold alloy.

Journal

  • Dental Materials Journal

    Dental Materials Journal 29 (1), 25-29, 2010

    The Japanese Society for Dental Materials and Devices

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