実装基板における検査技術の現状と展望  [in Japanese] The Current and Future Prospects in PWBA Test Technologies  [in Japanese]

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Author(s)

Journal

  • Journal of The Japan Institute of Electronics Packaging

    Journal of The Japan Institute of Electronics Packaging 13(1), 25-27, 2010-01-01

    The Japan Institute of Electronics Packaging

References:  4

Cited by:  2

Codes

  • NII Article ID (NAID)
    10025984420
  • NII NACSIS-CAT ID (NCID)
    AA11231565
  • Text Lang
    JPN
  • Article Type
    Journal Article
  • ISSN
    13439677
  • NDL Article ID
    10549591
  • NDL Source Classification
    ZN33(科学技術--電気工学・電気機械工業--電子工学・電気通信)
  • NDL Call No.
    Z74-B258
  • Data Source
    CJP  CJPref  NDL  J-STAGE 
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