Direct Patterning of Copper on Glass Substrates Using Photochemical Reduction

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  • Arimura Hidetoshi
    Graduate School of Science, Konan University Ishihara Chemical Co., Ltd.
  • Nakamichi Ryota
    Graduate School of Science, Konan University
  • Kimura Akihiro
    Graduate School of Science, Konan University
  • Tsuruoka Takaaki
    Faculty of Frontiers of Innovative Research in Science and Technology, Konan University
  • Akamatsu Kensuke
    Faculty of Frontiers of Innovative Research in Science and Technology, Konan University
  • Nawafune Hidemi
    Faculty of Frontiers of Innovative Research in Science and Technology, Konan University

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Other Title
  • 光化学還元法によるガラス基板上への銅のダイレクトパターニング
  • コウカガク カンゲンホウ ニ ヨル ガラス キバン ジョウ エ ノ ドウ ノ ダイレクトパターニング

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Abstract

Photochemical deposition of copper thin films was achieved using carboxylic acid as an electron donor for direct fabrication of minute copper circuit patterns on glass substrates. The photochemical reduction of copper ions could occur over the whole surfaces on which UV irradiation area. However, only the copper deposits remained on the surface of hydrophobic n-octadecyl trimethoxysilane patterns after washing with water. The selective lift-off of the copper films on hydrophilic glass surfaces could be achieved by washing with polar solvents such as water. The thickness of the copper films was easily controlled by varying the UV irradiation time. It has been determined that the mixed potential theory can be applied to this reaction based on the result of the local polarization curve measurement.

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