Transmission Electron Microscopy Study on Microstructure of Ag-Based Conductive Adhesives

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  • Kawamoto Naoyuki
    World Premier International (WPI) Research Center for Materials Nanoarchitectonics (MANA), National Institute for Materials Science
  • Murakami Yasukazu
    Institute of Multidisciplinary Research for Advanced Materials, Tohoku University
  • Shindo Daisuke
    Institute of Multidisciplinary Research for Advanced Materials, Tohoku University
  • Hayasaka Yuichiro
    High-voltage Electron Microscope Laboratory, Tohoku University
  • Kan Takeshi
    Electronics Materials Division, Fujikura Kasei Co., Ltd.
  • Suganuma Katsuaki
    The Institute of Scientific and Industrial Research, Osaka University

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Abstract

We used advanced electron microscopy techniques to study the microstructure of Ag-based conductive adhesives, which are promising alternatives to Pb-free solders. Systematic microscopy observations revealed the development of connections between Ag agglomerates, when the weight density of Ag (Ag content) was increased up to 92 mass%. However, in a sample containing 94 mass% Ag, disconnection between well-defined Ag agglomerates and/or formation of voids between Ag-filler particles were observed. These results appeared to be consistent with the plot of resistivity versus Ag content: the resistivity decreased to a minimum value at 92 mass% Ag. We also demonstrated the formation of very small Ag particles in a thin-foil specimen subjected to electrical breakdown. This microscopic observation may be useful for understanding the process of electric breakdown in thin-foil specimens.

Journal

  • MATERIALS TRANSACTIONS

    MATERIALS TRANSACTIONS 51 (10), 1773-1778, 2010

    The Japan Institute of Metals and Materials

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