無機系接着剤とその複合材料の高温下における弾性係数と強度

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タイトル別名
  • Evaluation of Elastic Modulus and Strength of Inorganic Adhesive and Its Composite at Elevated Temperature
  • ムキケイ セッチャクザイ ト ソノ フクゴウ ザイリョウ ノ コウオン カ ニ オケル ダンセイ ケイスウ ト キョウド

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Inorganic materials, such as monolithic ceramics, graphite and ceramic based composites, are expected for the material of structural parts used in high-temperature ambience. In this study, inorganic adhesives are adopted to bonding material for heat resistant joint of metals, and are also used for matrix of heat resistant composites. The inorganic adhesives used in the present study can be cured at 150°C and the maximum temperature resistance proposed is up to 1200°C. To establish the joining technology, we measured the elastic modulus of the bulk specimens and the composite specimens filled with aluminum particles and the bond strength at elevated temperatures up to 700°C. The experimental results of Young's modulus of the bulk specimens obtained by a dynamic flexural test are slightly decreased with heating from a room temperature (RT) to 500°C. However, the damping of free vibration of the specimen is increased remarkably from 500°C to 700°C. Young's moduli of the composite specimens with aluminum contents of 20% to 50 % show good stability reversibly in heating process up to 600°C and cooling process to RT. The strengths of the joints obtained by a push-out test are increased with temperature rise to 500°C and remarkably decreased with heating more that temperature. This paper mentioned the aluminum filler is effective to enhance the property of these types of inorganic adhesives up to 500°C.

収録刊行物

  • 実験力学

    実験力学 10 (3), 312-317, 2010

    日本実験力学会

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