A Fast Non-Contact Inspection Method through Dual Channel System for Flat Panel Manufacturing Processes
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- Hamori Hiroshi
- Graduate School of Engineering, Hiroshima University
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- Sakawa Masatoshi
- Faculty of Engineering, Hiroshima University
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- Katagiri Hideki
- Faculty of Engineering, Hiroshima University
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- Matsui Takeshi
- Faculty of Engineering, Hiroshima University
Bibliographic Information
- Other Title
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- フラットパネル製造工程におけるデュアルチャネルシステムに基づく高速非接触検査手法
- フラットパネル セイゾウ コウテイ ニ オケル デュアルチャネル システム ニ モトズク コウソク ヒセッショク ケンサ シュホウ
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Abstract
Research on the inspection and defect repair process for improving the production yield is becoming more important in the flat panel production process which has expanded remarkably in recent years. In this research, a new non-contact inspection method for the fast and accurate detection of electrical defects subject to repair in a-Si TFT circuits is proposed. The proposed method enables much faster inspection in comparison with the conventional Pin Probe inspection method which has been used for years. In addition, since it cannot only detect defects in the target circuit but also specify the location of each defect, a more efficient process management can be realized by having such information in common with the repair system. Further, this non-contact method can eliminate a running cost which has been the most serious problem in the test process by removing the need to replace the pin probing fixtures which vary depending on the circuit type.
Journal
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- Journal of The Japan Institute of Electronics Packaging
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Journal of The Japan Institute of Electronics Packaging 13 (7), 562-568, 2010
The Japan Institute of Electronics Packaging
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Details 詳細情報について
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- CRID
- 1390001204561201408
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- NII Article ID
- 10026965923
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- NII Book ID
- AA11231565
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- ISSN
- 1884121X
- 13439677
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- NDL BIB ID
- 10894891
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- Text Lang
- ja
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- Data Source
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- JaLC
- NDL
- Crossref
- CiNii Articles
- KAKEN
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- Abstract License Flag
- Disallowed