Influence on the Electro-Migration Resistance by Line Width and Average Grain Size along the Longitudinal Direction of Very Narrow Cu Wires

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Author(s)

Journal

  • Materials Transactions

    Materials Transactions 51(7), 1183-1187, 2010-07-01

    Japan Institute of Metals

References:  13

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  • Influence of Grain Size Distributions on the Resistivity of 80nm Wide Cu Interconnects

    KHOO Khyoupin , ONUKI Jin , NAGANO Takahiro , CHONAN Yasunori , AKAHOSHI Haruo , TOBITA Toshimi , CHIBA Masahiro , SAITO Tatsuyuki , ISHIKAWA Kensuke

    Materials Transactions 48(3), 622-624, 2007-03-01

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Cited by:  1

Codes

  • NII Article ID (NAID)
    10027018498
  • NII NACSIS-CAT ID (NCID)
    AA1151294X
  • Text Lang
    ENG
  • Article Type
    Journal Article
  • ISSN
    13459678
  • NDL Article ID
    10735742
  • NDL Source Classification
    ZP41(科学技術--金属工学・鉱山工学)
  • NDL Call No.
    Z53-J286
  • Data Source
    CJP  CJPref  NDL 
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