Room-Temperature Cu-Cu Bonding in Ambient Air Achieved by Using Cone Bump

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Author(s)

Journal

  • Applied physics express

    Applied physics express 4(1), "016501-1"-"016501-3", 2011-01-25

    Japan Society of Applied Physics

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    DOI  Cited by (2)

Cited by:  2

Codes

  • NII Article ID (NAID)
    10027782759
  • NII NACSIS-CAT ID (NCID)
    AA12295133
  • Text Lang
    ENG
  • Article Type
    Journal Article
  • ISSN
    18820778
  • NDL Article ID
    10948244
  • NDL Source Classification
    ZM35(科学技術--物理学)
  • NDL Call No.
    Z78-A526
  • Data Source
    CJP  CJPref  NDL 
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