高密度実装基板外観検査の動向  [in Japanese] Trends of Optical Inspection for High-Density PWBA  [in Japanese]

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Author(s)

Journal

  • Journal of The Japan Institute of Electronics Packaging

    Journal of The Japan Institute of Electronics Packaging 14(2), 90-93, 2011-03-01

    The Japan Institute of Electronics Packaging

References:  3

Cited by:  2

Codes

  • NII Article ID (NAID)
    10028107467
  • NII NACSIS-CAT ID (NCID)
    AA11231565
  • Text Lang
    JPN
  • Article Type
    Journal Article
  • ISSN
    13439677
  • NDL Article ID
    11031131
  • NDL Source Classification
    ZN33(科学技術--電気工学・電気機械工業--電子工学・電気通信)
  • NDL Call No.
    Z74-B258
  • Data Source
    CJP  CJPref  NDL  J-STAGE 
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