Effect of the Purity of the Copper Sulfate on the Microstructure and Resistivity of Very Narrow Cu Wires

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  • Tashiro Suguru
    Department of Material Science and Engineering, Faculty of Engineering, Ibaraki University
  • Khoo Khyoupin
    Department of Material Science and Engineering, Faculty of Engineering, Ibaraki University
  • Onuki Jin
    Department of Material Science and Engineering, Faculty of Engineering, Ibaraki University

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  • 超微細Ｃｕ配線の微細構造と抵抗率に及ぼす硫酸銅純度の影響
  • チョウビサイ Cu ハイセン ノ ビサイ コウゾウ ト テイコウリツ ニ オヨボス リュウサン ドウ ジュンド ノ エイキョウ

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Abstract

  The effect of the electrolyte purity on the resistivity of very narrow Cu wires has been investigated. The resistivity difference between high purity (6N) electrolyte and low purity (3N) electrolyte processes is relatively small (1.5%) when the line width is wide. However, it increases with the decrease in the line width, and it reaches about 17%, i.e., 2.9 μΩ•cm for the former and 3.5 μΩ•cm for the latter at the 50 nm line widths. A 50 nm Cu wire formed with the high purity electrolyte process had more uniform and larger grain sizes and lower impurity (oxygen) concentrations than the wire formed with the low impurity electrolyte process. The impact of the purity of electrolyte on the reduction of Cu wire resistivity is found to be much larger than that for anode plating material.<br>

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