Numerical Modeling of Through Silicon Via (TSV) Stacked Module with Micro Bump Interconnect for Biomedical Device

• KHONG C.

収録刊行物

• EPTC, December 2010

  EPTC, December 2010 195-200, 2010

詳細情報

• CRID: 1572543025635580928
• NII論文ID: 10030136315
• データソース種別:
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