Conditions to Prevent Die Cracking Associated with the Use of Zn-Al Alloys as Pb-Free Solder

• SHIMIZU T.

収録刊行物

• 6th Symposium on Microjoining and Assembly Technology in Electronics, February 3-4, 2000, Yokohama

  6th Symposium on Microjoining and Assembly Technology in Electronics, February 3-4, 2000, Yokohama 305-308, 2000

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• CRID: 1571980075682155392
• NII論文ID: 10030136338
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