半導体用ストレスバッファー材料の最新動向 Latest Technology of Stress Buffer Material for Semiconductor Application

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著者

    • 加藤 幸治 KATOH Kohji
    • 日立化成デュポンマイクロシステムズ(株)技術開発センタ Hitachi Chemical DuPont Microsystems Ltd.

抄録

Because polyimide (PI) / polybenzoxazole (PBO) materials make semiconductor reliability drastically improved, they have been applied to stress buffer layer for over 30 years. Their purpose used to prevent IC chip from mechanical attack by molding compound filler. In recent years, PI / PBO are required to perform stress relief. In addition to this, they have come to be used as dielectric layer for Cu redistribution layer application as semiconductor package type changes. Therefore, various properties and balanced performances are necessary for PI / PBO materials.<br>This paper reviews latest PI / PBO technologies in semiconductor application.

Because polyimide (PI) / polybenzoxazole (PBO) materials make semiconductor reliability drastically improved, they have been applied to stress buffer layer for over 30 years. Their purpose used to prevent IC chip from mechanical attack by molding compound filler. In recent years, PI / PBO are required to perform stress relief. In addition to this, they have come to be used as dielectric layer for Cu redistribution layer application as semiconductor package type changes. Therefore, various properties and balanced performances are necessary for PI / PBO materials.<br>This paper reviews latest PI / PBO technologies in semiconductor application.

収録刊行物

  • 日本ゴム協會誌

    日本ゴム協會誌 85(2), 40-45, 2012-02-15

    THE SOCIRETY OF RUBBER SCIENCE AND TECHNOLOGYY, JAPAN

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各種コード

  • NII論文ID(NAID)
    10030144036
  • NII書誌ID(NCID)
    AN00189720
  • 本文言語コード
    JPN
  • 資料種別
    REV
  • ISSN
    0029022X
  • NDL 記事登録ID
    023420677
  • NDL 請求記号
    Z17-125
  • データ提供元
    CJP書誌  NDL  J-STAGE 
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