バックグラインドテープの材料設計と評価技術 Material Design and Evaluation Technology of Backgrind Tape

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Backgrind tape (BG tape) is widely used in semiconductor process to protect wafer surface as well as to prevent wafer crack. Among those tapes employed in industries, BG tape can be characterized by high precision in thickness and clean design by controlling both foreign and residual contaminations. BG tape is composed of base film and adhesive covered by release film. For base film, EVA, PET or other layered materials have been used. Some special materials were also reported for well contacting bumpy wafer surface. Adhesive is designed with acrylate in general, and material design should be cared to reduce residue. UV-curable adhesive is also used. In the technology that wafer thickness becomes thinner, BG tape will compete with other materials. Design of BG tape should be further investigated for handling ultra-thin wafer with facility.

Backgrind tape (BG tape) is widely used in semiconductor process to protect wafer surface as well as to prevent wafer crack. Among those tapes employed in industries, BG tape can be characterized by high precision in thickness and clean design by controlling both foreign and residual contaminations. BG tape is composed of base film and adhesive covered by release film. For base film, EVA, PET or other layered materials have been used. Some special materials were also reported for well contacting bumpy wafer surface. Adhesive is designed with acrylate in general, and material design should be cared to reduce residue. UV-curable adhesive is also used. In the technology that wafer thickness becomes thinner, BG tape will compete with other materials. Design of BG tape should be further investigated for handling ultra-thin wafer with facility.

収録刊行物

  • 日本ゴム協會誌

    日本ゴム協會誌 85(2), 46-51, 2012-02-15

    THE SOCIRETY OF RUBBER SCIENCE AND TECHNOLOGYY, JAPAN

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各種コード

  • NII論文ID(NAID)
    10030144058
  • NII書誌ID(NCID)
    AN00189720
  • 本文言語コード
    JPN
  • 資料種別
    REV
  • ISSN
    0029022X
  • NDL 記事登録ID
    023420695
  • NDL 請求記号
    Z17-125
  • データ提供元
    CJP書誌  NDL  J-STAGE 
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