ダイシングテープの要求特性と開発動向 Requirements and Development Trend of Dicing Tapes

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Dicing tapes have been used for a Si wafer singulation at the IC packaging manufacturing. During the singulation, dicing tapes need to hold dies with high adhesion simultaneously with an easy die separation from the dicing tapes with low adhesion after singulation to prevent dies from breaking. In order to meet the requirements mentioned above, UV-curable dicing tapes, which is reviewed here, have been realized with both die-holding and easy-separation functions which are able to be controlled, independently. Moreover, with the popularity of the mobile devices, a packaging density and a die thickness tend to increase and decrease, respectively. For a reduction of thin wafer breaking, new thin-wafer processes, including a laser-dicing process, have been proposed and dicing tapes are required to have additional properties to realize those thin wafer processes. In this paper, the technical trend of dicing tapes for the new applications is presented.

Dicing tapes have been used for a Si wafer singulation at the IC packaging manufacturing. During the singulation, dicing tapes need to hold dies with high adhesion simultaneously with an easy die separation from the dicing tapes with low adhesion after singulation to prevent dies from breaking. In order to meet the requirements mentioned above, UV-curable dicing tapes, which is reviewed here, have been realized with both die-holding and easy-separation functions which are able to be controlled, independently. Moreover, with the popularity of the mobile devices, a packaging density and a die thickness tend to increase and decrease, respectively. For a reduction of thin wafer breaking, new thin-wafer processes, including a laser-dicing process, have been proposed and dicing tapes are required to have additional properties to realize those thin wafer processes. In this paper, the technical trend of dicing tapes for the new applications is presented.

収録刊行物

  • 日本ゴム協會誌

    日本ゴム協會誌 85(2), 52-57, 2012-02-15

    一般社団法人 日本ゴム協会

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各種コード

  • NII論文ID(NAID)
    10030144089
  • NII書誌ID(NCID)
    AN00189720
  • 本文言語コード
    JPN
  • 資料種別
    REV
  • ISSN
    0029022X
  • NDL 記事登録ID
    023420702
  • NDL 請求記号
    Z17-125
  • データ提供元
    CJP書誌  NDL  J-STAGE 
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