ポリイミド/エポキシ樹脂系ダイボンディングフィルムの材料設計 Material Design of the Die-bonding Film Based on Polyimide/Epoxy Resin

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著者

    • 増子 崇 MASUKO Takashi
    • 日立化成工業(株)筑波総合研究所 Telecommunication Materials Development Center, Tsukuba Research Laboratory, Hitachi Chemical Co., Ltd.

抄録

Die-bonding films have become the key technology to realize excellent reliability, high performance, high speed and high density of the devices, as well as smaller and thinner packages. We developed a novel die-bonding film based on polyimide/epoxy resin, which are useful to the CSPs (Chip Size/Scale Package). The film showed thermoplastic behavior before curing with molten performance at high temperatures above their <i>T</i>gs, and thermosetting behavior after curing with restricted flow behavior even above their <i>T</i>gs. The limited flow behavior results from the network structure formation in the film. The adhesion strength of the film when used as an adhesive film between two adherents having different thermal strains was affected by two main factors: the modulus and stress relaxation property of the film. In this review, the relationship between the chemical structure of the polyimides and the various properties of the films is discussed.

Die-bonding films have become the key technology to realize excellent reliability, high performance, high speed and high density of the devices, as well as smaller and thinner packages. We developed a novel die-bonding film based on polyimide/epoxy resin, which are useful to the CSPs (Chip Size/Scale Package). The film showed thermoplastic behavior before curing with molten performance at high temperatures above their <i>T</i>gs, and thermosetting behavior after curing with restricted flow behavior even above their <i>T</i>gs. The limited flow behavior results from the network structure formation in the film. The adhesion strength of the film when used as an adhesive film between two adherents having different thermal strains was affected by two main factors: the modulus and stress relaxation property of the film. In this review, the relationship between the chemical structure of the polyimides and the various properties of the films is discussed.

収録刊行物

  • 日本ゴム協會誌

    日本ゴム協會誌 85(2), 58-63, 2012-02-15

    一般社団法人 日本ゴム協会

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各種コード

  • NII論文ID(NAID)
    10030144102
  • NII書誌ID(NCID)
    AN00189720
  • 本文言語コード
    JPN
  • 資料種別
    REV
  • ISSN
    0029022X
  • NDL 記事登録ID
    023420729
  • NDL 請求記号
    Z17-125
  • データ提供元
    CJP書誌  NDL  J-STAGE 
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