Reduction of Damage of Soldering Iron Tip by Addition of Co and Ni to Sn-Ag-Cu Lead-free Solder

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To confirm the effectiveness of Co and Ni addition to Sn-Ag system lead-free solder on reduction of erosion of iron plating of soldering iron tip, Sn-Ag-Cu-Co(-Ni) system flux cored solder wires were used in operation lines under several manufacturing operation conditions. The temperatures of soldering iron were maintained at about 623–663K. The degree of damage was evaluated by cross sectional measurement of the thickness of Fe plating before and after soldering operation. The obtained data had relatively large scattering, but the Co and Ni addition was found to be effective to suppress erosion damage in all operation lines. Double addition of Co and Ni was also confirmed more effective than single addition of Co.

収録刊行物

  • 溶接学会論文集 : quarterly journal of the Japan Welding Society

    溶接学会論文集 : quarterly journal of the Japan Welding Society 27(2), 209s-213s, 2010-01-20

    一般社団法人 溶接学会

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各種コード

  • NII論文ID(NAID)
    10030149206
  • NII書誌ID(NCID)
    AN1005067X
  • 本文言語コード
    ENG
  • 資料種別
    ART
  • ISSN
    02884771
  • データ提供元
    CJP書誌  J-STAGE 
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