Bondability of Cu wire on Cu substrate with Sn plating by ultrasonic

• FUJIWARA Shinichi

  Hitachi, Ltd. Production Engineering Research Laboratory

• DAUSKARDT Reinhold H.

  Stanford University

Bibliographic Information

Other Title

• Snめっき付Cu板上へのCuワイヤボンディング接合

Journal

• 溶接学会論文集 : quarterly journal of the Japan Welding Society

  溶接学会論文集 : quarterly journal of the Japan Welding Society 28 (4), 362-368, 2010-12-31

Keywords

• Wire bonding
• Peel strength
• Ultrasonic
• Cu-Sn
• Heat treatment
• Cu wire
• Tin plating

Details

• CRID: 1572261550673733376
• NII Article ID: 10030150323
• NII Book ID: AN1005067X
• ISSN: 02884771
• Text Lang: ja
• Data Source:
  • CiNii Articles